- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 23/13 - Mountings, e.g. non-detachable insulating substrates characterised by the shape
Patent holdings for IPC class H01L 23/13
Total number of patents in this class: 2209
10-year publication summary
|
193
|
192
|
180
|
236
|
236
|
246
|
196
|
198
|
160
|
85
|
| 2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Intel Corporation | 45621 |
167 |
| Samsung Electronics Co., Ltd. | 131630 |
115 |
| Kyocera Corporation | 12735 |
110 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 36809 |
88 |
| Murata Manufacturing Co., Ltd. | 22355 |
61 |
| Mitsubishi Materials Corporation | 2378 |
59 |
| Invensas Corporation | 645 |
51 |
| Mitsubishi Electric Corporation | 43934 |
47 |
| Micron Technology, Inc. | 24960 |
46 |
| Toshiba Materials Co., Ltd. | 600 |
43 |
| Advanced Semiconductor Engineering, Inc. | 1546 |
40 |
| Samsung Electro-mechanics Co., Ltd. | 4798 |
36 |
| Kabushiki Kaisha Toshiba, doing business as Toshiba Corporation | 6275 |
36 |
| International Business Machines Corporation | 60644 |
32 |
| Infineon Technologies AG | 8189 |
28 |
| Rohm Co., Ltd. | 5843 |
28 |
| Denka Company Limited | 2189 |
26 |
| Qualcomm Incorporated | 76576 |
25 |
| NGK Insulators, Ltd. | 4589 |
25 |
| STATS ChipPAC Pte. Lte. | 1516 |
25 |
| Other owners | 1121 |